By Mark McCrate Edited by Clayton Smith
3D printers offer a bevy of manufacturing options, ranging from hobbyist tinkering to government agencies building dissertation worthy devices. Thankfully many designs are open sourced making proliferation easy. The “shoebox” case and control board are a great example of liberal copying, Figure 1 and Figure 2, respectively. These have been widely adopted for good reason. This older design architecture is very compact, easy to construct, lightweight with minimal external cabling, and has an intuitive interface to boot. However, those benefits come with a very real detriment—poor thermal management.
To prolong part life, prevent failures and perhaps improve performance, this article details several design modifications our hackerspace/makerspace implemented to remedy woes. They are broken into sections:
- Essential – for preventing problems and prolonging life
- Optional – to extend operating margins
- Troubleshooting needs – for our specific case to regain functionality of a burnt and baked PCB board
Feel free to focus on areas most pertinent to your situation. By following our hard learned lessons, hopefully you will be raving about saving some effort.
Note, the electronics board shown herein is based on the RepRap Melzi V2.0 documented here: https://reprap.com/wiki/Melzi and installed in the shoebox that is part of many products. If you have any of the growing list of products at the end of this essay, bookmark this page!
Essential 1: Check all fan air flow directions.
The goal of fans is to move heat as efficiently as possible. Whether your shoebox has only one fan or multiple, all air must flow in concert to move heat from inside to outside the enclosure. If fan flow direction needs altered, remove all supporting fasteners, flip fan(s) and reattach.
In our case (pun intended), the power supply exhausted directly onto the control board and the lone case fan pushed every warm air molecule on a collision course with the LCD screen, a fact easily verified by looking at the flow arrows molded into the fan’s plastic shroud; in lieu of finding visible arrows similar to those shown in Figure 3, hold a tissue near a running fan to reveal which way air is blowing. By reversing our fans, cooler ambient air is now pushed into the center of the box, impinges onto hot parts, gets directed toward the power supply inlet, travels through the power supply, and is then immediately whisked away by the case fan breeze. This change dropped the internal box temperature from sauna to only slightly above ambient!
Essential 2: Better heatsinks are a good way to get more heat out of components and into convecting air.
Figure 4 shows there were some rather squat anodized aluminum heatsinks with a questionable thermal compound interface. These had to go! To remove the old heatsinks we used pliers to gently twist and pull; another quick and easy method to remove heatsinks is by simply nudging them with a flat blade/head screw driver – they should pop right off. Once the old metal is out of the way use an alternating combination of concentrated rubbing alcohol, acetone, and a cotton swap to scrub and clear away any remaining adhesive from on or around the chip(s). We installed taller copper pin-finned heatsinks bonded with 3M 8815 thermally conductive tape. Thanks to this change, the heatsinks are no longer uncomfortably warm.
3M did not sponsor this work; it just so happens we used the same 8815 tape for another project years ago, with great success, and had extra.
Completing just the two essential tasks basically guarantees a long life and problem-free user experience, however, further optimization will expand operating margins. Two optional modifications are detailed below.
Optional 1: Improve overall airflow by reducing restrictions. Most shoebox designs have very few openings thereby restricting airflow which is odd because many tower PC cases devote five, six and sometimes more facets to air flow; as an example, look at Figure 5 which is basically a Swiss cheese structure! To further stress this point, when designing their ‘towers’ Apple has devoted design time to thermals as far back as always [citation needed] with their fan-free designs, asymmetrical blisk, zoned volumes, unified heatsink, etc. Apple’s 2021 white paper “Mac Pro Technology Overview,” archived HERE, highlights open chassis lattice design, pg. 21 or Figure 6, and devotes several paragraphs of the 45 page treatise to thermals. While it is possible to copy baffling structures, a more practical approach is to attack the outside with a drill and, like a deranged affineur, persist until the structure more closely resembles a fine Swiss cheese.
In our example, to increase air flow we started by removing the back panel (where all the heat was previously coaxed), laid out a grid pattern and hole size to maximize material removal while maintaining structural integrity, drilled and deburred. Our work is shown in Figure 7…increased exits points with nearly infinite more area and subsequently reduced backpressure.
Optional 2: Move all fans to places where they impinge directly onto high power / hot components.
Many 3D printer cases are designed with fans that suck air out of enclosed volumes, however, any pinholes short circuit this flow. A better arrangement, to maximize heat transfer, is to place fans proximal to and blowing directly on susceptible components, by doing so, warmed air can exit any aforementioned pinholes. Apple and others take it a step further by partitioning the tower for multi-fan multi-zone cooling, see white paper pg. 22 or Figure 8.
Moving the fan locations takes careful planning and it is an obstacle many will choose to avoid because it demands answering questions such as: will it clear all existing parts, are all necessary tools easy to acquire and does a new location require rewiring? We reasoned the effort was worthwhile, spent an evening moving a fan from the rear to the side, Figure 9, and measured a roughly 10*F lower box temperature despite forgoing the pains of installing baffles.
For most people those steps detailed above are the whole ordeal. Hopefully, your hardware is healthy and the essential and optional steps got implemented in time.
For the unfortunate, including our hackerspace, the journey started from a need to troubleshoot a loss of functionality (namely, no bed heating) and lead to a two-step recovery process.
Troubleshooting need 1: Fix PCB traces.
Upon removing our control board, a quick look at the its top, Figure 10, revealed discolored connectors complete with melted and charred plastic, while the bottom showed more signs of thermal stress including paint bubbles and reflowed dull solder joints, Figure 11. Probing around this troubled area with a multimeter, we discovered the root cause of no bed heating was a burnt trace/open circuit to the bed connector; apparently a concentration of current and heat was enough to burn the thin trace off the board.
A cool tip to both fix our open circuit problem and simultaneously increase trace conductance is to leave traces bare, then coat them with solder. Examples of this are prevalent especially in power supplies. EEVblog demonstrates this wonderfully on YouTube, EEVblog #317 – PCB Tinning Myth Busting.
To scrape off the solder mask and expose fresh copper traces, ripe for absorbing solder, we used a sharp razor blade. Going a step further, and to provide extra reinforcement to the pin, we applied solder generously around the pin base, much like mulching around a tree. At the time of writing, this abundance of solder has survived hours of “burn-in” testing.
Troubleshooting need 2: Install higher current connector(s).
Prior to executing the PCB trace fix, we removed the original charred pins, enlarged the paltry through holes and then installed larger pins from a new “Phoenix connector” with a higher current rating.
Having read this far is a testament to how much research and effort you are willing to devote to modifying your 3D printer for preserving performance and extending operational life.
List of Products
After gaining widespread adoption the common “shoebox”, Figure 12, is used in the following growing list of products.
IF YOU KNOW OF OTHERS PLEASE COMMENT TO HELP BUILD A MORE COMPREHENSIVE LIST!
Alfawise U20
Anet E10
Creality CR 10 mini
Creality CR 10
Creality CR 10 S4
Creality CR 10 S5
Creality CR 10 V2
Monoprice Maker Select 3D Printer v2
Tevo Tornado
Wanhao Duplicator i3